Branched-type nanocluster-junction fluorofluidic-gels for interface-adaptive thermal conduction and mechanical resistance

With the miniaturization and high integration of microelectronic devices, efficient thermal management is increasingly critical. Conventional thermal interface materials often suffer from a certain degree of mismatch between their thermal conductivity and contact thermal resistance. Herein, we develop a thermal interface fluorofluidic-gel with a branched-type nanocluster-junction network. Benefiting from the interfacial infiltration enabled by the branched-junction fluoronetwork and the efficient thermal pathways constructed by thermal conductive nanocomposites, the fluorofluidic-gel exhibits a high thermal conductivity of 5.89 W·m⁻¹·K⁻¹ and a low contact thermal resistance of 0.15 cm²·K·W⁻¹. It also achieves reversible adhesion and mechanical resistance, with an adhesive strength of 189.3 kPa, adhesion energy of 220.3 J·m⁻² and impact resistance of 3.91 J·cm⁻¹. In addition, this gel maintains thermal stability from −80 °C to 300 °C and exhibits an electrical breakdown strength exceeding 24 kV/mm. We ‌anticipate‌ that adaptive thermal interface fluorofluidic-gel presents a promising solution for high-heat-flux electronic thermal management. ‘Conventional thermal interface materials often suffer from a certain degree of mismatch between their thermal conductivity and contact thermal resistance. Here the authors develop a thermal interface fluorofluidic-gel with a branched-type nanocluster-junction network exhibiting high thermal conductivity and low contact thermal resistance.