Liquid-Nitrogen Micropillar-Wick Cooling for Cryogenic Electronics: A Numerical Study of Thermal Performance and Capillary Dry-Out Limits
In the authors' words
Cryogenic computing technologies are maturing rapidly, but heat removal remains a key challenge when increasing the device density and operating power. Two-phase evaporative cooling is a promising approach to solve this issue, because it can dissipate high heat fluxes while maintaining small temperature rises. Here, we numerically investigate liquid--filled silicon micropillar wicks as a capillary-fed thin-film evaporation concept for cryogenic electronics. The model combines Young-Laplace meniscus calculations, Hertz-Knudsen-Schrage evaporation, unit-cell heat-transfer and liquid-flow simulations, and an array-level thermal and capillary-flow model. For a representative geometry with a pillar diameter of , pitch of , and pillar height of at an applied heat flux of , the predicted chip-temperature rise is approximately . This is substantially below the estimated temperature rises for representative conduction cooling through an indium-interlayered copper heat sink and direct liquid- immersion. The corresponding predicted single-fed dry-out length is approximately , equivalent to an ideal double-fed coolable width of approximately . The results indicate that local thermal performance is favorable, whereas lateral scalability is primarily constrained by capillary dry-out. An approximate capillary-viscous scaling relation provides a compact framework for comparing dry-out limits across working fluids and related wick geometries and for identifying strategies to extend capillary-fed transport.
Appeared: Monday, September 21. arXiv. Preprint, not yet peer-reviewed.
Authors' comment: 24 pages, 9 figures, 1 table